Nucleation and growth of copper on 316L stainless steel from synthetic acidified copper sulfate was studied in the absence and presence of chloride ions and/or organic additives - HydroStar® 4208, DXG-F7® and Cyquest® N-900 - using a potentiostatic technique. The current-time data obtained at 0.16V versus the SHE were analyzed using nucleation and growth models. Scanning electron microscope (SEM) images of deposits produced at 300 A/m2 show that the addition of 20 mg/L chloride ions increased the size and reduced the number of copper nuclei. Potentiostatic current-time data from the electrolyte without organic additives, and confirmed by SEM images, indicate progressive nucleation with two-dimensional growth under diffusion control. None of the organic additives studied at a concentration of 2.5 mg/L with 20 mg/L chloride changed the nucleation and growth mechanism, but the additives increased the number and reduced the size of copper nuclei, leading to more uniform coverage of the stainless steel substrate.
- Additives,
- Copper,
- Electrowinning,
- Growth,
- Nucleation
Available at: http://works.bepress.com/michael-moats/46/