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About DongHyun (Bill) Kim

DongHyun (Bill) Kim received B.S., M.S. and Ph.D. degrees in electrical engineering from Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea, in 2012, 2014 and 2018, respectively. In 2018, he joined the Missouri University of Science and Technology (formerly University of Missouri-Rolla), Rolla, MO, USA, and is currently an Assistant Professor with the Missouri S&T EMC Laboratory, Rolla, MO, USA. 

His current research interests include nanometer-scale devices, through-silicon via (TSV) technology, dielectric material characterization and signal integrity (SI), power integrity (PI), temperature integrity (TI), electromagnetic compatibility (EMC) and electrostatic discharge (ESD) in 2.5D/3D IC systems. 
He is a recipient of IEEE-HKN Outstanding Young Professional Award, IEEE EMC Society Herbert K. Mertel Young Professional award, the IEEE Region 5 Outstanding Young Professional (formerly GOLD) Award, IEEE St. Louis Section Outstanding Young Engineer Award, IEEE APEMC Outstanding Young Scientist Award and DesignCon Best Paper Award. He is a co-recipient of DesignCon Early Career Best Paper Awards and IEEE EMC Symposium Best Paper Awards. He is currently serving as the vice-chair of IEEE EMC Society TC-10 (Signal Integrity and Power Integrity) and the Chair of IEEE St. Louis Section.

Positions

November 2023 - Present College of Engineering and Computing Dean’s Scholar, Missouri University of Science and Technology ‐ Electrical and Computer Engineering
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August 2019 - Present Assistant Professor, Missouri University of Science and Technology ‐ Electrical and Computer Engineering
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2018 - August 2019 Visiting Assistant Research Professor, Missouri University of Science and Technology ‐ Electromagnetic Compatibility (EMC) Laboratory
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January 2016 - April 2016 Visiting Researcher, Nanyang Technological University
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Curriculum Vitae

Disciplines

Research Interests

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Professional Service and Affiliations

2023 - Present Chair, IEEE Region 5 St. Louis Section
2022 - Present Vice-Chair, IEEE EMC Society Technical Committee 10 - Signal and Power Integrity
2019 - Present Member, IEEE-Eta Kappa Nu (HKN)
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Honors and Awards

  • IEEE-HKN Outstanding Young Professional Award (11/2023)
  • College of Engineering and Computing Dean’s Scholar (11/2023-08/2025)
  • 1st Herbert K. Mertel Young Professional Award, IEEE EMC Society (08/2023)
  • DesignCon 2022 Early Career Best Paper Award, informa markets (01/2023)
  • Young Scientist Award, 2022 APEMC, IEEE (09/2022)
  • Best Student Paper Award, 2022 APEMC, IEEE (09/2022)
  • Best SIPI Symposium Paper Award, 2022 EMC + SIPI Symposium, IEEE (08/2022)
  • DesignCon 2021 Early Career Best Paper Award, informa markets (06/2022)
  • IEEE Region 5 Outstanding Young Professional (formerly GOLD) Award, IEEE (04/2022)
  • IEEE St. Louis Section Outstanding Young Engineer Award, IEEE (12/2021)
  • Best SIPI Student Paper Award, 2021 EMC + SIPI Symposium, IEEE (08/2021)
  • DesignCon 2020 Best Paper Award, informa markets (08/2021)
  • Best SIPI Student Paper Award, 2020 EMC + SIPI Symposium, IEEE (08/2020)
  • Samsung Electro-Mechanics 1nside Edge Paper Award, Samsung (2014)

Education

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2018 Ph.D. in Electrical and Computer Engineering, Korea Advanced Institute of Science and Technology (KAIST)
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2014 M.S. in Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST)
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2012 B.S. in Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST)
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Links

Contact Information

119 Emerson Electric Company Hall, Missouri S&T
Rolla, MO 65409

573-341-4262

Email:

ORCID

Research Works (87)