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Article
Strain-Induced Energy Band Gap Opening in Two-Dimensional Bilayered Silicon Film
Journal of Electronic Materials
  • Z. Ji, Wright State University - Main Campus
  • R. Zhou
  • L. C. Lew Yan Voon
  • Yan Zhuang, Wright State University - Main Campus
Document Type
Article
Publication Date
10-1-2016
Abstract

© 2016, The Minerals, Metals & Materials Society. This work presents a theoretical study of the structural and electronic properties of bilayered silicon film (BiSF) under in-plane biaxial strain/stress using density functional theory (DFT). Atomic structures of the two-dimensional (2-D) silicon films are optimized by using both the local-density approximation (LDA) and generalized gradient approximation (GGA). In the absence of strain/stress, five buckled hexagonal honeycomb structures of the BiSF with triangular lattice have been obtained as local energy minima, and their structural stability has been verified. These structures present a Dirac-cone shaped energy band diagram with zero energy band gaps. Applying a tensile biaxial strain leads to a reduction of the buckling height. Atomically flat structures with zero buckling height have been observed when the AA-stacking structures are under a critical biaxial strain. Increase of the strain between 10.7% and 15.4% results in a band-gap opening with a maximum energy band gap opening of ∼0.17 eV, obtained when a 14.3% strain is applied. Energy band diagrams, electron transmission efficiency, and the charge transport property are calculated. Additionally, an asymmetric energetically favorable atomic structure of BiSF shows a non-zero band gap in the absence of strain/stress and a maximum band gap of 0.15 eV as a −1.71% compressive strain is applied. Both tensile and compressive strain/stress can lead to a band gap opening in the asymmetric structure.

DOI
10.1007/s11664-016-4682-3
Citation Information
Z. Ji, R. Zhou, L. C. Lew Yan Voon and Yan Zhuang. "Strain-Induced Energy Band Gap Opening in Two-Dimensional Bilayered Silicon Film" Journal of Electronic Materials Vol. 45 Iss. 10 (2016) p. 5040 - 5047 ISSN: 03615235
Available at: http://works.bepress.com/yan_zhuang/24/