Thin film multilayers hare previously been introduced on multilayer low temperature cofired ceramic (LTCC), as well as initial thin film capacitors on LTCC The ruggedness of a multipurpose Ti/Cu/Pt/Au stack for connectivity and RF conductivity has continued to benefit fabrication and reliability- in state of-the-art modules, while the capacitors have followed the traditional Metal-Insulator-Metal (MIM) style The full integration of thin film passives with thin film connectivity traces is presented. Certain passives, such as capacitors, require specifically tailored and separately patterned thin film (multi-)layers, including a dielectric. Different capacitance values are achieved by variation of both the insulator layer thickness and die active area of the capacitor. Other- passives, such as filter's, require only the conductor - a single thin film multilayer. This can be patterned from the same connectivity thin film material (Ti/Cu/Pt/Au), or a specially tailored thin film material (e.g. Ti/Cu/Au) can be deposited. Both versions are described, including process and integration details. Examples are discussed, ranging from patterning for maximum tolerances, to space and performance-optimized designs. Cross-sectional issues associated with integration are also highlighted in the discussion.