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Presentation
Thermal expansion and Gruneisen parameters in some Pr–Ni–Si compounds
Ames Laboratory Conference Papers, Posters, and Presentations
  • S. H. Song, Iowa State University
  • David C. Jiles, Iowa State University
  • J. E. Snyder, Iowa State University
  • A. O. Pecharsky, Iowa State University
  • D. Wu, Iowa State University
  • Kevin W. Dennis, Iowa State University
  • Thomas A. Lograsso, Iowa State University
  • R. William McCallum, Iowa State University
Document Type
Conference Proceeding
Conference
49th Annual Conference on Magnetism and Magnetic Materials
Publication Date
5-16-2005
DOI
10.1063/1.1853894
Geolocation
(30.3321838, -81.65565099999998)
Abstract
In this study, the thermal expansion and Gruneisen parameter of polycrystalline “Pr5Ni2Si3” and “Pr15Ni7Si10” were investigated over the temperature range of 5–300 K. Calculations of the phonon contribution to thermal expansion were made, which allowed the magnetic contribution to thermal expansion to be calculated from the difference between the total thermal expansion and the phonon contribution. This resulted in a temperature-dependent magnetic contribution to thermal expansion that varied with the magnetic ordering of the material. The results show two magnetic transitions in each compound, the higher temperature transition corresponding to the Curie temperature and the lower temperature transition resulting from a spin reorientation.
Comments

Copyright 2005 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics.

The following article appeared in Journal of Applied Physics 97 (2005): 10M313 and may be found at http://dx.doi.org/10.1063/1.1855196.

Copyright Owner
American Institute of Physics
Language
en
Citation Information
S. H. Song, David C. Jiles, J. E. Snyder, A. O. Pecharsky, et al.. "Thermal expansion and Gruneisen parameters in some Pr–Ni–Si compounds" Jacksonville, FL(2005)
Available at: http://works.bepress.com/thomas_lograsso/161/