Article
Determination of High Frequency Package Currents from Near-Field Scan Data
Proceedings of the 2005 International Symposium on Electromagnetic Compatibility (2005, Chicago, IL)
Abstract
Integrated circuits (ICs) are often a significant source of radiated energy from electronic systems. Near-field magnetic scanning is an effective tool for measuring the current distribution in IC packages and investigating chiplevel EMI problems. This paper discusses analysis of near-magnetic field scan data using tangential and normal field measurements. Results show that combining near-field scan results from probes with multiple orientations is an effective way to identify the current paths in IC packages.
Meeting Name
2005 International Symposium on Electromagnetic Compatibility, EMC 2005 (2005: Aug. 8-12, Chicago, IL)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
- EMI,
- IC,
- Near-field Magnetic Scanning,
- VLSI
International Standard Book Number (ISBN)
0-7803-9380-5
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2005 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
8-1-2005
Publication Date
01 Aug 2005
Disciplines
Citation Information
Xiaopeng Dong, Shaowei Deng, Daryl G. Beetner, Todd H. Hubing, et al.. "Determination of High Frequency Package Currents from Near-Field Scan Data" Proceedings of the 2005 International Symposium on Electromagnetic Compatibility (2005, Chicago, IL) Vol. 3 (2005) p. 679 - 683 ISSN: 2158-110X Available at: http://works.bepress.com/thomas-vandoren/29/