Article
Detecting Brittle Fracture Failures
Advanced Packaging
Abstract
The article focuses on the implication of the back-end process in comparing brittle fracture in semiconductor elements in the U.S. A correlation analysis illustrates the failure and brittle failure percentage of ball shear. According to a micro-structural observations, high-speed bond testing and conventional drop testing are the two important methodologies in evaluating brittle failure in shear.
Department(s)
Mathematics and Statistics
Keywords and Phrases
- semiconductor industry,
- fracture mechanics,
- shear (mechanics),
- microelectrics
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2007 Penwell, All rights reserved.
Publication Date
1-1-2007
Publication Date
01 Jan 2007
Disciplines
Citation Information
Stephen L. Clark. "Detecting Brittle Fracture Failures" Advanced Packaging (2007) Available at: http://works.bepress.com/stephen_clark/47/