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Article
Detecting Brittle Fracture Failures
Advanced Packaging
  • Stephen L. Clark, Missouri University of Science and Technology
Abstract

The article focuses on the implication of the back-end process in comparing brittle fracture in semiconductor elements in the U.S. A correlation analysis illustrates the failure and brittle failure percentage of ball shear. According to a micro-structural observations, high-speed bond testing and conventional drop testing are the two important methodologies in evaluating brittle failure in shear.

Department(s)
Mathematics and Statistics
Keywords and Phrases
  • semiconductor industry,
  • fracture mechanics,
  • shear (mechanics),
  • microelectrics
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2007 Penwell, All rights reserved.
Publication Date
1-1-2007
Publication Date
01 Jan 2007
Citation Information
Stephen L. Clark. "Detecting Brittle Fracture Failures" Advanced Packaging (2007)
Available at: http://works.bepress.com/stephen_clark/47/