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Contribution to Book
The evaluation of an integrated stress management intervention program among Chinese health care workers
Proceedings of the IEEE Symposium on Web Society, 2010
  • Jia Yan LIU, Beihang University
  • Oi Ling SIU, Lingnan University, Hong Kong
  • Kan SHI, Graduate University of Chinese Academy of Sciences
Document Type
Book chapter
Publication Date
8-1-2010
Publisher
IEEE Press
Keywords
  • health care workers,
  • intervention,
  • burnout,
  • work well-being
Abstract

This study tested whether or not an integrated stress management intervention program can reduce job burnout and increase work well-being among Chinese health care employees. To this end, a one-group pretest-posttest design was adopted, and paired t-tests were used to verify the effects of the intervention training course program. 200 health care workers were recruited from Chinese public hospitals to participate in a three-day training course held in 4 separate classes, with an average of 50 persons in each class. A total of 162 matched participants (33 males, 129 females) completed the pretest and posttest surveys. The results obtained from paired t-tests consistently demonstrated reductions after training in job burnout and its three dimensions, including emotional exhaustion, depersonalization and reduced personal accomplishment, and improvements in work well-being, positive emotions, and work-family balance. Implications of these findings for research and practice are discussed.

DOI
10.1109/SWS.2010.5607398
Publisher Statement
Copyright © IEEE 2010. Access to external full text or publisher's version may require subscription.
Additional Information
ISBN of the source publication: 9781424463596
Full-text Version
Publisher’s Version
Citation Information
Liu, J.-y., Siu, O.-l., & Shi, K. (2010). The evaluation of an integrated stress management intervention program among Chinese health care workers. In T. Zhu, Q. Gao, & B. Li (Eds.), Proceedings of the IEEE Symposium on Web Society, 2010 (pp. 501-506). Piscataway, New Jersey: IEEE Press. doi: 10.1109/SWS.2010.5607398