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Dry Adhesion Based on Electrospun Polymer Fibers
ASME 2010 International Mechanical Engineering Congress and Exposition
  • Qiang Shi, The University Of Akron
  • Shing Chung Josh Wong, University of Akron Main Campus
  • Todd Blackledge, The University of Akron
  • Johnny F. Najem, University of Akron Main Campus
  • Kai-Tak Wan
Document Type
Conference Proceeding
Publication Date
11-1-2010
Abstract
Dry Adhesion exists between polymer nano/microfibers. An elaborate experiment was performed to directly measure the adhesion between electrospun poly(ε-caprolactone) (PCL) microfibers using a nano force tensile tester. Electrospun nano/microfibers with radius ranging from 0.2 to 1.1 μm were investigated. It was found that the adhesion force depended on the fiber radius following a linear relationship, which complied with the classical Johnson-Kendall-Roberts (JKR) contact mechanics model. The force increased with temperature and decreased with relative humidity between two fibers positioned in orthogonal directions. Our data suggested the van der Waals’ (vdW) interactions are primarily operative between the micro-/nano-fibers.
Citation Information
Qiang Shi, Shing Chung Josh Wong, Todd Blackledge, Johnny F. Najem, et al.. "Dry Adhesion Based on Electrospun Polymer Fibers" ASME 2010 International Mechanical Engineering Congress and Exposition Vol. 12 (2010) p. 163 - 167
Available at: http://works.bepress.com/shing-chung_wong/91/