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Measurement of Adhesion Work of Electrospun Polymer Membrane by Shaft-Loaded Blister Test
Langmuir
  • Haining Na, University of Akron, main campus
  • Pei Chen, University of Akron, main campus
  • Kai-Tak Wan
  • Shing Chung Josh Wong, University of Akron Main Campus
  • Qian Li, University of Akron, main campus
  • Zhijun Ma, University of Akron, main campus
Document Type
Article
Publication Date
4-2-2012
Abstract

The work of adhesion at the interface of electrospun membrane and rigid substrate is measured by a shaft-loaded blister test (SLBT). Poly(vinylidene fluoride) (PVDF) were electrospun with an average fiber diameter of 333 ± 59 nm. Commercial cardboard with inorganic coating was used to provide a model substrate for adhesion tests. In SLBT, the elastic response PVDF was analyzed and its adhesion energy measured. The average value of the adhesion work is 206 ± 26 mJ/m2. Elastic modulus of electrospun membrane obtained by SLBT is found to be 23.42 ± 2.69 MPa, which is consistent with the value obtained from standard tensile tests. The results show SLBT presented a viable methodology for evaluating the adhesion energy of electrospun polymer fabrics.

Citation Information
Haining Na, Pei Chen, Kai-Tak Wan, Shing Chung Josh Wong, et al.. "Measurement of Adhesion Work of Electrospun Polymer Membrane by Shaft-Loaded Blister Test" Langmuir Vol. 28 Iss. 16 (2012) p. 6677 - 6683
Available at: http://works.bepress.com/shing-chung_wong/8/