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Assessing Benefits of a Buried Interconnect Layer in Digital Designs
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (2016)
  • Liheng Zhu
  • Yasmine Badr
  • Shaodi Wang, University of California, Los Angeles
  • Subramanian Iyer
  • Puneet Gupta
Publication Date
Spring May 24, 2016
DOI
10.1109/TCAD.2016.2572144
Citation Information
Liheng Zhu, Yasmine Badr, Shaodi Wang, Subramanian Iyer, et al.. "Assessing Benefits of a Buried Interconnect Layer in Digital Designs" IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (2016) ISSN: 1937-4151
Available at: http://works.bepress.com/shaodi-wang/10/