Analysis of a Microchannel Interconnect Based on the Clustering of Smart-Pixel-Device WindowsApplied Optics
PublisherOptical Society of America
AbstractA design analysis of a telecentric microchannel relay system developed for use with a smart-pixel-based photonic backplane is presented. The interconnect uses a clustered-window geometry in which optoelectronic device windows are grouped together about the axis of each microchannel. A Gaussian-beam propagation model is used to analyze the trade-off between window size, window density, transistor count per smart pixel, and lenslet ƒ-number for three cases of window clustering. The results of this analysis show that, with this approach, a window density of 4000 windows/cm2 is obtained for a window size of 30 µm and a device plane separation of 25 mm. In addition, an optical power model is developed to determine the nominal power requirements of a 32 × 32 smart-pixel array as a function of window size. The power requirements are obtained assuming a complementary metal-oxide semiconductor inverter-amplifier and dual-rail multiple-quantum-well self-electro-optic-effect devices as the receiver stage of the smart pixel.
Citation InformationD.R. Rolston, B. Robertson, H.S. Hinton, and D.V. Plant, "Analysis of a Microchannel Interconnect Based on the Clustering of Smart-Pixel-Device Windows," Applied Optics Vol. 35, No. 8, March 10, 1996, pp. 1220-1233.