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Analysis of a Microchannel Interconnect Based on the Clustering of Smart-Pixel-Device Windows
Applied Optics
  • D. R. Rolston
  • B. Robertson
  • Harvard Scott Hinton, Utah State University
  • D. V. Plant
Document Type
Optical Society of America
Publication Date
A design analysis of a telecentric microchannel relay system developed for use with a smart-pixel-based photonic backplane is presented. The interconnect uses a clustered-window geometry in which optoelectronic device windows are grouped together about the axis of each microchannel. A Gaussian-beam propagation model is used to analyze the trade-off between window size, window density, transistor count per smart pixel, and lenslet ƒ-number for three cases of window clustering. The results of this analysis show that, with this approach, a window density of 4000 windows/cm2 is obtained for a window size of 30 µm and a device plane separation of 25 mm. In addition, an optical power model is developed to determine the nominal power requirements of a 32 × 32 smart-pixel array as a function of window size. The power requirements are obtained assuming a complementary metal-oxide semiconductor inverter-amplifier and dual-rail multiple-quantum-well self-electro-optic-effect devices as the receiver stage of the smart pixel.
Originally published by the Optical Society of America. Publisher's PDF available through remote link.
Citation Information
D.R. Rolston, B. Robertson, H.S. Hinton, and D.V. Plant, "Analysis of a Microchannel Interconnect Based on the Clustering of Smart-Pixel-Device Windows," Applied Optics Vol. 35, No. 8, March 10, 1996, pp. 1220-1233.