The design, modeling, and characterization of FET-SEED smart pixel transceiver arrays fabricated for application in optical backplanes are presented. Results of digital and analog measurements on 4×4 transmitter arrays and 4×4 receiver arrays, packaged at the printed circuit-board level, will be presented. In addition, these results will be compared to device and circuit models developed for these optoelectronics. Finally, the description of the successful application of these optoelectronics to interconnect two printed circuit boards will be described.
Design, Modeling, and Characterization of FET-SEED Smart Pixel Transceiver Arrays for Optical BackplanesIEEE Journal of Quantum Electronics
Citation InformationD.V. Plant, A.Z. Shang, M.R. Otazo, D.R. Rolston, B. Robertson, and H.S. Hinton, "Design, Modeling, and Characterization of FET-SEED Smart Pixel Transceiver Arrays for Optical Backplanes," IEEE J. Quantum. Electronics, Vol. 32, No. 8, August 1996, pp. 1391-1398.