Plasma Deposition of Spin Chucks to Reduce Contamination of Silicon WafersUnited States Patent Number: 6,955,720
AbstractAn apparatus for delivering a fluidic media to a wafer includes a housing defining a process chamber. A fluidic media delivery member is coupled to the process chamber. A rotatable chuck is positioned in the process chamber. The rotatable chuck has a wafer support surface coated with a coating material. A vacuum supply line is coupled to the rotatable chuck.
Number of Pages11
Citation InformationEmir Gurer, Ed C. Lee and Richard Savage. "Plasma Deposition of Spin Chucks to Reduce Contamination of Silicon Wafers" United States Patent Number: 6,955,720 (2005)
Available at: http://works.bepress.com/rsavage/11/