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Plasma Deposition of Spin Chucks to Reduce Contamination of Silicon Wafers
United States Patent Number: 6,955,720
  • Emir Gurer, ASML Holding, Veldhoven, Netherlands
  • Ed C. Lee, ASML Holding, Veldhoven, Netherlands
  • Richard Savage, ASML Holding, Veldhoven, Netherlands
Publication Date
10-18-2005
Abstract

An apparatus for delivering a fluidic media to a wafer includes a housing defining a process chamber. A fluidic media delivery member is coupled to the process chamber. A rotatable chuck is positioned in the process chamber. The rotatable chuck has a wafer support surface coated with a coating material. A vacuum supply line is coupled to the rotatable chuck.

Number of Pages
11
Publisher statement
Also available from the United States Patent and Trademark Office. Website: http://www.uspto.gov.
Citation Information
Emir Gurer, Ed C. Lee and Richard Savage. "Plasma Deposition of Spin Chucks to Reduce Contamination of Silicon Wafers" United States Patent Number: 6,955,720 (2005)
Available at: http://works.bepress.com/rsavage/11/