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Article
Special Topic on Materials and Devices for 5G Electronics
Applied Physics Letters
  • Nathan D. Orloff, National Institute of Standards and Technology
  • Rick Ubic, Boise State University
  • Michael Lanagan, Penn State University
Document Type
Article
Publication Date
2-7-2022
Abstract

Next generation communications are inspiring entirely new applications in education, healthcare, and transportation. These applications are only possible because of improvements in latency, data rates, and connectivity in the latest generation. Behind these improvements are new materials and devices that operate at much higher frequencies than ever before, a trend that is likely to continue.

Copyright Statement

This article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing. This article appeared in

Orloff, N.D., Ubic, R., & Lanagan, M. (2022). Special Topic on Materials and Devices for 5G Electronics. Applied Physics Letters, 120(6), 060402.

and may be found at https://doi.org/10.1063/5.0079175.

Citation Information
Nathan D. Orloff, Rick Ubic and Michael Lanagan. "Special Topic on Materials and Devices for 5G Electronics" Applied Physics Letters (2022)
Available at: http://works.bepress.com/rick_ubic/127/