A Mathematical Model for Electroless Copper Deposition on Planar SubstratesJournal of the Electrochemical Society
Subject Area(s)Chemical Engineering
AbstractA mathematical model for the electroless deposition of copper on a planar electrode is presented and used to make time-dependent predictions on the various quantities in the system. The model takes into account mass transport by diffusion and migration, Butler-Volmer kinetics at the electrode surface, and mixed potential theory. A finite difference approach is used to solve the equations, and the resultant model is used to predict the concentration profiles, potential response, and plating rate as a function of time and concentration of various reactive components.
Citation InformationM. Ramasubramanian, Branko N Popov, Ralph E White and K. S Chen. "A Mathematical Model for Electroless Copper Deposition on Planar Substrates" Journal of the Electrochemical Society (1999) p. 111 - 116
Available at: http://works.bepress.com/ralph_white/253/