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Article
3D integration of planar crossbar memristive devices with CMOS substrate
Nanotechnology (2014)
  • Peng Lin, University of Massachusetts - Amherst
  • Shuang Pi, University of Massachusetts - Amherst
  • Qiangfei Xia, University of Massachusetts - Amherst
Abstract
Memristive devices are promising building blocks for enhanced CMOS hardware in data storage and computing. Nanoimprint lithography (NIL) has been an enabling technology in the past decade for exploring novel devices and circuits. In this paper, the authors review the progress and technical aspects of the fabrication and integration of memristor crossbar arrays using NIL. Since the key component of successful fabrication is the imprint mold, the material selection, master mold fabrication, anti-sticking treatment and cleaning are first discussed. The requirements and composition of imprint resists, in particular low-viscosity liquid resists that cross-link upon ultraviolet light radiation, are investigated next. After the description of imprint systems and alignment mechanisms, a disruptive self-alignment fabrication scheme for crossbar arrays is presented. Finally, the first implementation of a memristor/CMOS hybrid circuit using NIL on foundry-made CMOS substrates, together with more recent developments, is recounted. The challenges and possible solutions for NIL as a primary tool for crossbar fabrication are also proposed and discussed.
Publication Date
2014
Publisher Statement
doi:10.1088/0957-4484/25/40/405202 The published version is located at http://iopscience.iop.org/0957-4484/25/40/405202
Citation Information
Peng Lin, Shuang Pi and Qiangfei Xia. "3D integration of planar crossbar memristive devices with CMOS substrate" Nanotechnology Vol. 25 Iss. 405202 (2014)
Available at: http://works.bepress.com/qiangfei_xia/12/