Anodization1 as well as dissolution2 of reactive metals such as aluminum results in buildup of significant levels of stresses on the reacting surface. In-situ measurement of stress evolution can provide remarkable insights into the associated electrochemical reactions and help in understanding the governing mechanisms. We report a curvature interferometry based technique for in-situ monitoring of stress evolution. Curvature interferometer is incorporated into the electrochemical cell and is used to monitor the curvature changes of the samples in order to determine the stress-thickness product of the film formed on the reacting surface.