Article
Residual stress, strain and faults in nanocrystalline palladium and copper
Materials Science and Engineering: A
(2000)
Abstract
Nanocrystalline Pd and Cu, prepared by inert-gas condensation and warm compaction, were studied using X-ray diffraction techniques. A sample of Cu with submicrometer grain size produced by severe plastic deformation was also examined. The Warren-Averbach technique was used to separate the line broadening due to grain size, t.m.s. strain and faults. Peak shifts and asymmetry were used to determine the long-range surface stresses, stacking-fault probability and twin probability. Young's modulus for a Pd sample was determined by an ultrasonic technique and compared with the coarse-grained, fully dense value.
Keywords
- Nanocrystalline,
- Faults,
- Strain,
- Palladium,
- Copper
Disciplines
Publication Date
January 19, 2000
DOI
10.1016/0921-5093(95)09928-X
Publisher Statement
© 1995 Elsevier Science S.A. Publisher's version of record: https://doi.org/10.1016/0921-5093(95)09928-X
Citation Information
Paul G. Sanders, A. B. Witney, J. R. Weertman, R. Z. Valiev, et al.. "Residual stress, strain and faults in nanocrystalline palladium and copper" Materials Science and Engineering: A Vol. 204 Iss. 1-2 (2000) p. 7 - 11 ISSN: 0921-5093 Available at: http://works.bepress.com/paul-sanders/49/