Screen Printing Process Design of Experiments for Fine Line Printing of Thick Film Ceramic Substrates1998 Proceedings of the International Symposium on Microelectronics: San Diego, CA
AbstractScreen printing has been the dominant method of thick film deposition because of its low cost. Many experiments in industry have been done and many models of the printing process have been developed since the 1960’s. With a growing need for denser packaging and a drive for higher pin count, screen printing has been refined to yield high resolution prints. However, fine line printing is still considered by industry to be difficult. In order to yield high resolution prints with high first pass yields and manufacturing throughput, the printing process must be controlled stringently. This paper focuses on investigating the effect of manufacturing process parameters on fine line printing through the use of statistical design of experiments (DOE). The process parameters include print speed, squeegee hardness, squeegee pressure, and snap-off distance. Response variables are mean width and standard deviation of 10 mil, 8 mil, and 5 mil lines in both parallel and perpendicular directions relative to the squeegee travel direction. It is concluded that the squeegee hardness has a statistically significant effect on both directions, while the squeegee speed has an effect only on the parallel direction. The implementation procedures of the experimental design are presented. The analysis of a 2k factorial design with center points pertaining to the fine line printing experiment is discussed in detail.
Copyright1998 International Microelectronics And Packaging Society.
Citation InformationJianbiao Pan, Gregory L. Tonkay and Alejandro Quintero. "Screen Printing Process Design of Experiments for Fine Line Printing of Thick Film Ceramic Substrates" 1998 Proceedings of the International Symposium on Microelectronics: San Diego, CA (1998) p. 264 - 269
Available at: http://works.bepress.com/pan/24/