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Article
Cantilever testing of sintered-silver interconnects
Journal of Materials Science: Materials in Electronics (2018)
  • Andrew A. Wereszczak, Oak Ridge National Laboratory
  • Branndon R. Chen, Oak Ridge Associated Universities
  • Branndon R. Chen, Oak Ridge National Laboratory
  • Osama M. Jadaan, University of Mount Union
  • Brian A. Oistad, Oak Ridge Associated Universities
  • Brian A. Oistad, Oak Ridge National Laboratory
  • Max C. Modugno, Oak Ridge Associated Universities
  • Max C. Modugno, Oak Ridge National Laboratory
  • Jeffrey W. Sharp, Marlow Industries
  • James R. Salvador, General Motors
Publication Date
January 1, 2018
DOI
10.1007/s10854-017-8063-3
Citation Information
Andrew A. Wereszczak, Branndon R. Chen, Branndon R. Chen, Osama M. Jadaan, et al.. "Cantilever testing of sintered-silver interconnects" Journal of Materials Science: Materials in Electronics Vol. 29 Iss. 2 (2018) p. 1530 - 1541
Available at: http://works.bepress.com/osama-jadaan/9/