"Edge-Controlled Mechanical Failure of Si and SiC Semiconductor Chips†" by Andrew A Wereszczak

Selected Works of Osama Jadaan

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Edge-Controlled Mechanical Failure of Si and SiC Semiconductor Chips†

Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) (2010)

Andrew A Wereszczak, Oak Ridge National Laboratory
Osama M. Jadaan, University of Wisconsin–Platteville
Timothy Philip Kirkland, Oak Ridge National Laboratory

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Disciplines

Materials Science and Engineering and
Structural Engineering

Publication Date

January 1, 2010

DOI

10.4071/HITEC-AWereszczak-THA11

Citation Information

Andrew A Wereszczak, Osama M. Jadaan and Timothy Philip Kirkland. "Edge-Controlled Mechanical Failure of Si and SiC Semiconductor Chips†" Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) Vol. 2010 (2010) p. 325 - 332
Available at: http://works.bepress.com/osama-jadaan/18/