"CMOS Chip Planarization by Chemical Mechanical Polishing for a Vertically Stacked Metal MEMS Integration" by H. Lee

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Article

CMOS Chip Planarization by Chemical Mechanical Polishing for a Vertically Stacked Metal MEMS Integration

Journal of Micromechanics and Microengineering

H. Lee
M. H. Miller
T. G. Biffano

Link

Document Type

Article

Date of Publication

1-1-2004

Disciplines

Engineering

DOI

https://ui.adsabs.harvard.edu/link_gateway/2004JMiMi..14..108L/doi:10.1088/0960-1317/14/1/015

Citation Information

H. Lee, M. H. Miller and T. G. Biffano. "CMOS Chip Planarization by Chemical Mechanical Polishing for a Vertically Stacked Metal MEMS Integration" Journal of Micromechanics and Microengineering Vol. 14 Iss. 1 (2004) p. 108 - 115
Available at: http://works.bepress.com/michele-miller/58/