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Article
Analysis of Scanning Acoustic Microscopy Images of IC Chips
Review of Progress in Quantitative Nondestructive Evaluation
  • J. A. Khan, Iowa State University
  • Mani Mina, Iowa State University
  • L. Udpa, Iowa State University
  • S. S. Udpa, Iowa State University
Location
Snowmass Village, CO
Start Date
1-1-1995 12:00 AM
Disciplines
Description

The detection, isolation, and characterization of flaws in components represent a critical need in manufacturing and quality control. Nondestructive testing (NDT) provides an effective way of inspecting materials for ensuring the quality and integrity of products and systems. Consequently, nondestructive inspection finds extensive application in several industries such as steel, nuclear and electronic industries for the evaluation of complex test objects with minimal interruption of routine operations[1].

Book Title
Review of Progress in Quantitative Nondestructive Evaluation
Chapter
Chapter 3: Interpretive Signal Processing and Image Analysis
Section
Imaging and Reconstruction
Pages
915-922
DOI
10.1007/978-1-4615-1987-4_115
Language
en
File Format
application/pdf
Citation Information
J. A. Khan, Mani Mina, L. Udpa and S. S. Udpa. "Analysis of Scanning Acoustic Microscopy Images of IC Chips" Vol. 14A (1995)
Available at: http://works.bepress.com/mani_mina/6/