Skip to main content
Article
Development of a colloidal lithography method for patterning nonplanar surfaces
Langmuir
  • Sarang P. Bhawalkar, The University Of Akron
  • Jun Qing
  • Michael C. Heiber, The University Of Akron
  • Li Jia, The University of Akron
Document Type
Article
Publication Date
10-15-2010
Abstract

A colloidal lithography method has been developed for patterning nonplanar surfaces. Hexagonal noncontiguously packed (HNCP) colloidal particles 127 nm−2.7 μm in diameter were first formed at the air−water interface and then adsorbed onto a substrate coated with a layer of polymer adhesive 17 nm thick. The adhesive layer plays the critical role of securing the order of the particles against the destructive lateral capillary force generated by a thin film of water after the initial transfer of the particles from the air−water interface. The soft lithography method is robust and very simple to carry out. It is applicable to a variety of surface curvatures and for both inorganic and organic colloidal particles.

Citation Information
Sarang P. Bhawalkar, Jun Qing, Michael C. Heiber and Li Jia. "Development of a colloidal lithography method for patterning nonplanar surfaces" Langmuir Vol. 26 Iss. 22 (2010) p. 16662 - 16666
Available at: http://works.bepress.com/li_jia/17/