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Article
Diffusion Bond Inspection Using a Pulsed Digital Reflection Acoustic Microscope
Review of Progress in Quantitative Nondestructive Evaluation
  • Leonard J. Bond, University College London
  • Amit K. Som, University College London
  • Klara Shiloh, University College London
  • Kevin J. Taylor, British Aerospace plc
Location
Brunswick, ME
Start Date
1-1-1990 12:00 AM
Description
In the joining of metals there is a growing use of the family of advanced methods for solid state bonding, which includes friction welding and diffusion bonding. With these joining techniques a new range of quality and inspection problems are encountered. These problems, in particular for diffusion bonds, have become well known and there are the requirements for inspection techniques which can be used to give data to correlate with the bond’s mechanical strength. Various studies [1,2,3] have considered the destructive examination of bonds and categorised these in terms of characteristics seen in an examination of micrographic sections. A range of ultrasonic studies have also been undertaken [4,5,6], however conventional C-scan techniques have yet to be shown to provide the required reliable bond characterisation.
Book Title
Review of Progress in Quantitative Nondestructive Evaluation
Chapter
Chapter 7: Engineered Materials
Section
Metal-Metal Joints
Pages
1339-1346
DOI
10.1007/978-1-4684-5772-8_172
Language
en
File Format
application/pdf
Citation Information
Leonard J. Bond, Amit K. Som, Klara Shiloh and Kevin J. Taylor. "Diffusion Bond Inspection Using a Pulsed Digital Reflection Acoustic Microscope" Vol. 9B (1990)
Available at: http://works.bepress.com/leonard_bond/18/