Article
PAM4 Signaling Considerations for High-Speed Serial Links
Proceedings of the 2016 IEEE International Symposium on Electromagnetic Compatibility (2016, Ottawa, Canada)
Abstract
The paper discusses current challenges and advantages of multi-level signaling for high-speed serial links, showing the differences and similarities in link-path analysis between binary and multi-level signaling. Comparison of two signaling methodologies is given from the general theory viewpoint, as well as on the basis of various tests regarding crosstalk, jitter, equalizations and different channel characteristics, such as material, impedance and overall manufacturing design sensitivity.
Meeting Name
2016 IEEE International Symposium on Electromagnetic Compatibility (2016: Jul. 25-29, Ottawa, Canada)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Center for High Performance Computing Research
Second Research Center/Lab
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
- Electromagnetic compatibility,
- Pulse amplitude modulation,
- Regression analysis,
- Channel characteristics,
- equalization,
- General theory,
- High speed serial links,
- Manufacturing design,
- Multi-level signaling,
- PAM4,
- Path analysis,
- Signaling,
- NRZ
International Standard Book Number (ISBN)
978-1-5090-1442-2
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
7-29-2016
Publication Date
29 Jul 2016
Citation Information
Nana Dikhaminjia, Junping He, Mikheil Tsiklauri, James L. Drewniak, et al.. "PAM4 Signaling Considerations for High-Speed Serial Links" Proceedings of the 2016 IEEE International Symposium on Electromagnetic Compatibility (2016, Ottawa, Canada) (2016) p. 906 - 910 ISSN: 1077-4076 Available at: http://works.bepress.com/jun-fan/94/