Article
Analytical Equivalent Circuit Modeling for Multiple Core Vias in a High-Speed Package
Proceedings of the 2016 IEEE International Symposium on Electromagnetic Compatibility (2016, Ottawa, Canada)
Abstract
Core vias found in the packages of high-speed ICs can have a large impact on overall channel performance. Thus accurately modeling core vias in the package is essential. In this paper analytical methodologies are used to calculate equivalent circuit models of core vias.
Meeting Name
2016 IEEE International Symposium on Electromagnetic Compatibility (2016: Jul. 25-29, Ottawa, Canada)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Center for High Performance Computing Research
Second Research Center/Lab
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
- Equivalent Circuit,
- Modeling,
- Core Via,
- Package,
- Analytical
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
7-1-2016
Publication Date
01 Jul 2016
Citation Information
Shuai Jim, Ji Zhang, Jane Lim, Kelvin Qiu, et al.. "Analytical Equivalent Circuit Modeling for Multiple Core Vias in a High-Speed Package" Proceedings of the 2016 IEEE International Symposium on Electromagnetic Compatibility (2016, Ottawa, Canada) (2016) ISSN: 2158-1118 Available at: http://works.bepress.com/jun-fan/68/