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Article
Extraction of a SPICE Via Model from Full-Wave Modeling for Differential Signaling
Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2004, Santa Clara, CA)
  • Shaofeng Luan
  • Giuseppe Selli
  • James L. Drewniak, Missouri University of Science and Technology
  • Andrea de Luca
  • Giulio Antonini
  • Antonio Orlandi
  • Antonio Ciccomancini Scogna
  • Jun Fan, Missouri University of Science and Technology
  • James L. Knighten
  • Norman W. Smith
  • Ray Alexander
Abstract

This paper presents a procedure for building SPICE models for via transitions in differential signaling. The method of extracting parameters of SPICE models from a full-wave simulation tool is demonstrated. Then the validity of the SPICE models is studied by comparing the solution from the SPICE models with that from the full-wave simulation.

Meeting Name
IEEE International Symposium on Electromagnetic Compatibility (2004: Aug. 9-13, Santa Clara, CA)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
  • PCB,
  • SPICE,
  • SPICE Via Model,
  • Circuit Simulation,
  • Differential Signaling,
  • Digital Circuit System Designs,
  • Full-Wave Modeling,
  • High-Speed Digital Designs,
  • Printed Circuit Boards,
  • Printed Circuit Design,
  • Signal Integrity,
  • Via Transitions,
  • Via Transition,
  • Bit Error Rate,
  • Capacitance,
  • Data Transfer,
  • Dielectric Materials,
  • Inductance,
  • Interfaces (Computer),
  • Signal Processing
International Standard Book Number (ISBN)
780384431
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2004 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
8-1-2004
Citation Information
Shaofeng Luan, Giuseppe Selli, James L. Drewniak, Andrea de Luca, et al.. "Extraction of a SPICE Via Model from Full-Wave Modeling for Differential Signaling" Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2004, Santa Clara, CA) Vol. 2 (2004) p. 577 - 582 ISSN: 1077-4076
Available at: http://works.bepress.com/jun-fan/304/