An evaluation is presented on the L–2L de-embedding method for on-chip transmission lines. The method is analyzed using measurement data from two chips. Results are presented in terms of scattering parameters, as is the standard for characterizing system interconnects. The various challenges associated with on-chip modeling and measurements are discussed. Furthermore, a revised version of the L–2L method is presented, decreasing its sensitivity to measurement noise. All de-embedding results are compared back to "ideal" simulation models for validation or disproof.