Article
De-Embedding Comparisons of 1X-Reflect SFD, 1-Port AFR, and 2X-Thru SFD
Proceedings of the 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (2018, Singapore, Singapore)
Abstract
The procedures of lX-Reflect Smart Fixture De-embedding (SFD), 1-Port Auto Fixture Removal (AFR), and 2X-Thru SFD are compared from various perspectives: test fixture design, the de-embedding procedure, and the de-embedded results. The accuracy of the fixture characterization and de-embedded result is the key figure of merit (FOM) in each de-embedding method. Full-wave models were built to evaluate the FOM of these three methods, by comparing the scattering parameters (S-parameters) and TDR. A test coupon for measuring the USB-C cables is adopted to serve as manufactured validation purpose.
Meeting Name
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC (2018: May 14-18, Singapore, Singapore)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Sponsor(s)
National Science Foundation (U.S.)
Comments
This paper is based upon work supported partially by the National Science Foundation under Grant No. IIP-1440110.
Keywords and Phrases
- 1-PortAFR,
- 2X-Thru SFD,
- De-embedding,
- Full-wave model,
- LX-Reflect SFD,
- USB-C
International Standard Book Number (ISBN)
978-1-5090-3955-5
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
5-1-2018
Publication Date
01 May 2018
Disciplines
Citation Information
Yuan Chen, Bichen Chen, Jiayi He, Richard Zai, et al.. "De-Embedding Comparisons of 1X-Reflect SFD, 1-Port AFR, and 2X-Thru SFD" Proceedings of the 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (2018, Singapore, Singapore) (2018) p. 160 - 164 Available at: http://works.bepress.com/jun-fan/237/