Article
Extracting CAD Models for Quantifying Noise Coupling Between Vias in PCB Layouts
Proceedings of the 52nd IEEE Electronic Components and Technology Conference (2002, San Diego, CA)
Abstract
A method to extract a lumped element prototype SPICE model is used to study noise coupling between non-parallel traces on a PCB. The parameters in this model are extracted using a PEEC-like approach, a Circuit Extraction approach based on a Mixed-Potential Integral Equation formulation (CEMPIE). Without large numbers of unknowns, the SPICE model saves computation time. Also, it is easy to incorporate into system SPICE net list to acquire the system simulation result considering the coupling between traces on the printed circuit board (PCB). A representative case is studied, and the comparison of measurements, CEMPIE simulation, and SPICE modeling are given.
Meeting Name
52nd IEEE Electronic Components and Technology Conference (2002: May 28-31, San Diego, CA)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
- CAD Model,
- CEMPIE Simulation,
- PCB Layout,
- PEEC,
- SPICE,
- Circuit Extraction,
- Circuit Layout CAD,
- Circuit Noise,
- Equivalent Circuits,
- Integral Equations,
- Lumped Element SPICE Model,
- Mixed-Potential Integral Equation,
- Noise Coupling,
- Nonparallel Traces,
- Parameter Extraction,
- Printed Circuit Layout,
- Via,
- Computer Aided Design,
- Computer Simulation,
- Electric Lines,
- Mathematical Models,
- Matrix Algebra,
- Spurious Signal Noise,
- Quantifying Noise,
- Printed Circuit Boards
International Standard Book Number (ISBN)
780374304
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2002 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
5-1-2002
Publication Date
01 May 2002
Disciplines
Citation Information
Shaofeng Luan, Jun Fan, W. Liu, Fengchao Xiao, et al.. "Extracting CAD Models for Quantifying Noise Coupling Between Vias in PCB Layouts" Proceedings of the 52nd IEEE Electronic Components and Technology Conference (2002, San Diego, CA) (2002) p. 343 - 346 ISSN: 0569-5503 Available at: http://works.bepress.com/jun-fan/130/