Article
Application of Transmission Line Models to Backpanel Plated Through-Hole Via Design
Proceedings of the IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging (2005, Austin, TX)
Abstract
This paper introduces an approach of using a plated through-hole (PTH) via transmission-line model in the design of a thick printed circuit board, such as a backpanel. Full wave FEM modeling of a section of backpanel containing a differential via pair was compared with a transmission model. Computed values of the differential transmission loss agreed within an acceptable range for engineering studies, yet the transmission line model results required less than 2% of the computation time that the full wave model required. Effects of via spacing, via diameter and trace thickness were also examined.
Meeting Name
IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging (2005: Oct. 24-26, Austin, TX)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
- Circuit Simulation,
- Differential Transmission Loss,
- Differential Via Pair,
- Finite Element Analysis,
- Full Wave FEM Modeling,
- Plated Through-Hole Via Design,
- Printed Circuit Board,
- Printed Circuit Design,
- Trace Thickness,
- Transmission Line Models,
- Transmission Lines,
- Via Diameter,
- Via Spacing
International Standard Book Number (ISBN)
978-0780392205
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2005 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
10-1-2005
Publication Date
01 Oct 2005
Disciplines
Citation Information
Shaowei Deng, Todd H. Hubing, James L. Drewniak, Jun Fan, et al.. "Application of Transmission Line Models to Backpanel Plated Through-Hole Via Design" Proceedings of the IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging (2005, Austin, TX) (2005) p. 99 - 102 Available at: http://works.bepress.com/jun-fan/115/