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Article
Copper Alloy-Impregnated Carbon-Carbon Hybrid Composites for Electronic Packaging Applications
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
  • S. K. Datta, Cleveland State University
  • Surendra N. Tewari, Cleveland State University
  • Jorge E. Gatica, Cleveland State University
  • W. Shih, BFGoodrich Aerospace
  • L. Bentsen, BFGoodrich Aerospace
Document Type
Article
Publication Date
1-1-1999
Abstract
Porous carbon-carbon preforms, based on three-dimensional networks of PAN (Polyacrylonitrile)-based carbon fibers and various volume fractions of chemical vapor-deposited (CVD) carbon, were impregnated by oxygen-free, high-conductivity (OFHC) Cu, Cu-6Si-0.9Cr, and Cu-0.3Si-0.3Cr (wt pct) alloys by pressure infiltration casting. The obtained composites were characterized for their coefficient of thermal expansion (CTE) and thermal conductivity (K) along the through-thickness and two in-plane directions. One composite, with a 28 vol pct Cu-0.3Si-0.3Cr alloy, showed outstanding potential for thermal management applications in electronic applications. This composite exhibited approximately isotropic thermal expansion properties (CTE = 4 to 6.5 ppm/K) and thermal conductivities (k greater than or equal to 260 W/m K).
DOI
10.1007/s11661-999-0205-7
Version
Publisher's PDF
Citation Information
Datta, S.K., Tewari, S.N, Gatica, J.E., Shih, W., & Bentsen, L. (1999). Copper Alloy-Impregnated Carbon-Carbon Hybrid Composites for Electronic Packaging Applications. Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science 30, 175-181.