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Article
Chemical Synthesis and Characterization of Low Thermal Expansion- High Conductivity Cu-Mo and Ag-Mo Composites
2000
  • Jonathan Stolk, Franklin W. Olin College of Engineering
  • Arumugam Manthiram
Document Type
Article
Publication Date
4-1-2000
Abstract
Heat dissipation and thermal expansion mismatch are extremely important issues in many electrical and electronics applications, and the materials used for thermal managementin such applications have attracted a great deal of attention in recent years. The move in the microelectronics industry toward higher circuit board chip densities and packageless chip designs such as flip chips has prompted the need for improved thermal management materials. If heat extraction and thermal expansion are not properly addressed, thermal mismatch among the materials in electronic assemblies may lead to high interfacial shear strains and premature component failure.
Comments

© 2000 SpringerLink. This article was published in Metallurgical and Materials Transactions A, vol. 31, no.9, p. 2396-2398 and may be found here.

Citation Information
Jonathan Stolk and Arumugam Manthiram. "Chemical Synthesis and Characterization of Low Thermal Expansion- High Conductivity Cu-Mo and Ag-Mo Composites" (2000)
Available at: http://works.bepress.com/jonathan_stolk/22/