"Enhancement of Thermal Contact Conductance of Coated Junctions" by Kee-Chiang Chung

Selected Works of John W. Sheffield

Article

Enhancement of Thermal Contact Conductance of Coated Junctions

Journal of Thermophysics and Heat Transfer

Kee-Chiang Chung
John W. Sheffield, Missouri University of Science and Technology

Department(s)

Mechanical and Aerospace Engineering

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

Publication Date

1-1-1995

Publication Date

01 Jan 1995

Disciplines

Aerospace Engineering and
Mechanical Engineering

Citation Information

Kee-Chiang Chung and John W. Sheffield. "Enhancement of Thermal Contact Conductance of Coated Junctions" Journal of Thermophysics and Heat Transfer (1995) ISSN: 0887-8722
Available at: http://works.bepress.com/john-sheffield/8/