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Article
Enhancement of Thermal Contact Conductance of Coated Junctions
Journal of Thermophysics and Heat Transfer
  • Kee-Chiang Chung
  • John W. Sheffield, Missouri University of Science and Technology
Department(s)
Mechanical and Aerospace Engineering
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 1995 American Institute of Aeronautics and Astronautics (AIAA), All rights reserved.
Publication Date
1-1-1995
Publication Date
01 Jan 1995
Citation Information
Kee-Chiang Chung and John W. Sheffield. "Enhancement of Thermal Contact Conductance of Coated Junctions" Journal of Thermophysics and Heat Transfer (1995) ISSN: 0887-8722
Available at: http://works.bepress.com/john-sheffield/8/