Article
Thermal Contact Conductance of Ceramic Substrate Junctions
Journal of Heat Transfer
Department(s)
Mechanical and Aerospace Engineering
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 1995 American Society of Mechanical Engineers (ASME), All rights reserved.
Publication Date
5-1-1995
Publication Date
01 May 1995
Disciplines
Citation Information
John W. Sheffield, Kee-Chiang Chung and H. K. Benson. "Thermal Contact Conductance of Ceramic Substrate Junctions" Journal of Heat Transfer (1995) ISSN: 0022-1481 Available at: http://works.bepress.com/john-sheffield/20/