"Thermal Contact Conductance of Ceramic Substrate Junctions" by John W. Sheffield

Selected Works of John W. Sheffield

Article

Thermal Contact Conductance of Ceramic Substrate Junctions

Journal of Heat Transfer

John W. Sheffield, Missouri University of Science and Technology
Kee-Chiang Chung
H. K. Benson

Department(s)

Mechanical and Aerospace Engineering

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

Publication Date

5-1-1995

Publication Date

01 May 1995

Disciplines

Aerospace Engineering and
Mechanical Engineering

Citation Information

John W. Sheffield, Kee-Chiang Chung and H. K. Benson. "Thermal Contact Conductance of Ceramic Substrate Junctions" Journal of Heat Transfer (1995) ISSN: 0022-1481
Available at: http://works.bepress.com/john-sheffield/20/