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Article
Characterization of Airflow Impedance in Two Types of Telecommunications Chassis
Proceedings of the Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (2004)
  • Jinny Rhee, San Jose State University
  • Gilbert Wong, San Jose State University
Abstract

The airflow impedance curve for two common configurations used in telecommunications chassis were measured and examined in non-dimensional coordinates, such that data obtained at sea level may be scaled to increased altitudes. The results show that the non-dimensional airflow impedance curves for both chassis configurations predict minimal changes in air velocity with increased altitude for most of the Reynolds number ranges studied. However, for one chassis configuration studied, a slight decrease in air velocity is predicted with increased altitude. Because a nonconservative component temperature predictions at high altitude will result if constant air velocity is assumed, the decrease in air velocity should be accounted for if there are critical electronic components operating near their maximum temperatures. Reliable operation of electronic components in telecommunications equipment up to 4000 m (13,000 ft.) is a requirement of the Network Equipment and Building Standard (NEBS).

Keywords
  • airflow impedance,
  • telecommunications chassis
Disciplines
Publication Date
2004
Publisher Statement
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Citation Information
Jinny Rhee and Gilbert Wong. "Characterization of Airflow Impedance in Two Types of Telecommunications Chassis" Proceedings of the Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (2004)
Available at: http://works.bepress.com/jinny_rhee/16/