It is well-known that the performance and reliability of integrated circuits and other electronics are functions of operating temperature. The accurate prediction of temperature distributions for such applications poses engineering challenges due to many factors, including complex convection flows, non-uniform thermal boundary conditions, extrapolation to operation in extreme environments, and demanding steady-state and transient design requirements. In addition, the ever-increasing heat dissipation in a smaller package volume requires solutions with ever-increasing heat transfer and heat capacity. Thermal analysis and prediction based on superposition techniques are currently not as well-known as the use of numerical simulation tools readily available today. However, they are a powerful alternative to numerical simulation tools, especially for the complex scenarios that arise in this application. Superposition techniques can be applied to the design and interpretation of experiments and numerical simulations, and have the potential to form the building blocks of engineering tools that are more generally applicable to a wide range of challenging heat transfer problems