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Article
Microcavity Strain Sensor for High Temperature Applications
Optical Engineering
  • Amardeep Kaur, Missouri University of Science and Technology
  • Steve Eugene Watkins, Missouri University of Science and Technology
  • Jie Huang, Missouri University of Science and Technology
  • Lei Yuan
  • Hai Xiao, Missouri University of Science and Technology
Abstract

A microcavity extrinsic Fabry-Perot interferometric (EFPI) fiber-optic sensor is presented for measurement of strain. The EFPI sensor is fabricated by micromachining a cavity on the tip of a standard single-mode fiber with a femtosecond (fs) laser and is then self-enclosed by fusion splicing another piece of single-mode fiber. The fs-laser-based fabrication makes the sensor thermally stable to sustain temperatures as high as 800°C. The sensor exhibits linear performance for a range up to 3700 µε and a low temperature sensitivity of only 0.59 pm/°C through 800°C.

Department(s)
Electrical and Computer Engineering
Sponsor(s)
National Science Foundation (U.S.)
Comments
The authors acknowledge the support of National Science Foundation project under grant CMMI-1200787.
Keywords and Phrases
  • Fabry-Perot,
  • Femtosecond (fs) laser,
  • Femtosecond-laser,
  • Low temperature sensitivity,
  • Optical fiber sensor,
  • Standard single mode fibers,
  • Strain analysis,
  • Thermally stable,
  • Composite micromechanics,
  • Fabry-Perot interferometers,
  • High temperature applications,
  • Interferometry,
  • Microcavities,
  • Micromachining,
  • Single mode fibers,
  • Temperature,
  • Sensors,
  • Extrinsic Fabry-Perot interferometric
Document Type
Article - Journal
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2014 The Authors, All rights reserved.
Creative Commons Licensing
Creative Commons Attribution 3.0
Publication Date
1-1-2014
Publication Date
01 Jan 2014
Citation Information
Amardeep Kaur, Steve Eugene Watkins, Jie Huang, Lei Yuan, et al.. "Microcavity Strain Sensor for High Temperature Applications" Optical Engineering Vol. 53 Iss. 1 (2014) ISSN: 0091-3286
Available at: http://works.bepress.com/jie-huang/59/