Article
Femtosecond Laser Processing of Transparent Materials for Assembly-Free Fabrication of Photonic Microsensors
Proceedings of SPIE, Laser Applications in Microelectronic and Optoelectronic Manufacturing XXI
Abstract
In this paper, we summarize our recent research progresses on the understanding, design, fabrication, characterization of various photonic sensors for energy, defense, environmental, biomedical and industry applications. Femtosecond laser processing/ablation of various glass materials (fused silica, doped silica, sapphire, etc.) will be discussed towards the goal of one-step fabrication of novel photonic sensors and new enabling photonic devices. A number of new photonic devices and sensors will be presented.
Meeting Name
SPIE LASE (2016: Feb. 15-18, San Francisco, CA)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
- Characterization,
- Fabrication,
- Fused silica,
- Glass,
- Laser applications,
- Manufacture,
- Microelectronics,
- Photonic devices,
- Sapphire,
- Silica,
- Ultrashort pulses, Doped silicas,
- Femtosecond laser micromachining,
- Femtosecond laser processing,
- Glass materials,
- Industry applications,
- Photonic sensors,
- Recent researches,
- Transparent material, Laser materials processing
International Standard Book Number (ISBN)
978-1628419702
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2016 SPIE, All rights reserved.
Publication Date
2-1-2016
Publication Date
01 Feb 2016
Disciplines
Citation Information
Lei Yuan, Yinan Zhang, Jie Huang, Jie Liu, et al.. "Femtosecond Laser Processing of Transparent Materials for Assembly-Free Fabrication of Photonic Microsensors" Proceedings of SPIE, Laser Applications in Microelectronic and Optoelectronic Manufacturing XXI Vol. 9735 (2016) ISSN: 0277-786X Available at: http://works.bepress.com/jie-huang/38/