Article
Design of Airflow Aperture Arrays in Shielding Enclosures
Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (1998, Denver, CO)
Abstract
EMI through perforation patterns for airflow in shielding enclosures resulting from coupling of interior sources is investigated numerically with FDTD simulations and experimentally. The FDTD simulations are compared with measurements on perforation patterns. A simple empirical design approach for the relation between aperture size, the number of apertures and shielding effectiveness is extracted. A double perforation pattern structure is proposed for perforation pattern designs where a high percentage of open area is required. Frequencies where the enclosure will support cavity modes are of primary concern.
Meeting Name
IEEE International Symposium on Electromagnetic Compatibility (1998: Aug. 24-28, Denver, CO)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
- EMI,
- FDTD Simulations,
- Airflow Aperture Arrays Design,
- Aperture Size,
- Cavity Modes,
- Double Perforation Pattern Structure,
- Electromagnetic Interference,
- Electromagnetic Shielding,
- Finite Difference Time-Domain Analysis,
- Interior Sources Coupling,
- Open Area,
- Perforation Pattern Measurements,
- Perforation Patterns,
- Shielding Enclosures,
- Computer Simulation,
- Electric Shielding,
- Enclosures,
- Frequency Domain Analysis,
- Numerical Analysis,
- Airflow Aperture Arrays,
- Electromagnetic Compatibility
International Standard Book Number (ISBN)
780350154
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 1998 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
8-1-1998
Publication Date
01 Aug 1998
Disciplines
Citation Information
Min Li, S. Radu, J. Neubel, James L. Drewniak, et al.. "Design of Airflow Aperture Arrays in Shielding Enclosures" Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (1998, Denver, CO) Vol. 2 (1998) p. 1059 - 1063 ISSN: 0190-1494 Available at: http://works.bepress.com/james-drewniak/82/