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Article
Inductance Model of Decoupling Capacitors Including the Local Environment
Proceedings of the IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (2017, San Jose, CA)
  • Tamar Makharashvili
  • Ying S. Cao
  • Albert E. Ruehli, Missouri University of Science and Technology
  • James L. Drewniak, Missouri University of Science and Technology
  • Daryl G. Beetner, Missouri University of Science and Technology
Abstract

The key purpose of power distribution networks is to maintain a low impedance power source for integrated circuit(s) for the stable supply voltage. In this paper, using the equivalent series capacitor inductance leads to inaccurate estimates of power bus impedance. A simple modeling approach is presented to estimate the inductance associated with the decoupling capacitors which accounts for the capacitor geometry, for connections to the capacitor, and for the capacitor height above the return plane.

Meeting Name
IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017 (2017: Oct. 15-18, San Jose, CA)
Department(s)
Electrical and Computer Engineering
Comments
This paper is based upon work supported in part by the National Science Foundation under Grant No. IIP-1440110.
Keywords and Phrases
  • Electronics packaging,
  • Decoupling capacitor,
  • Inductance models,
  • Local environments,
  • Power bus impedance,
  • Power distribution network,
  • Series capacitors,
  • Simple modeling,
  • Supply voltages,
  • Inductance
International Standard Book Number (ISBN)
978-1-5386-3631-2
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
10-18-2017
Publication Date
18 Oct 2017
Citation Information
Tamar Makharashvili, Ying S. Cao, Albert E. Ruehli, James L. Drewniak, et al.. "Inductance Model of Decoupling Capacitors Including the Local Environment" Proceedings of the IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (2017, San Jose, CA) (2017) ISSN: 2165-4115
Available at: http://works.bepress.com/james-drewniak/421/