Article
Stressed Jitter Analysis for Physical Link Characterization
Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2010, Fort Lauderdale, FL)
Abstract
A link-path analysis approach is introduced in this paper based on the frequency-domain S-parameters of the link path. Different jitter components are also modelled and can be injected into the analysis to characterize the link responses to different types of jitter input. Stressed link path analysis can be very useful in practical engineering designs in terms of link path optimization, device selection and qualification, etc.
Meeting Name
IEEE International Symposium on Electromagnetic Compatibility (2010: Jul. 25-30, Fort Lauderdale, FL)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
- Device Selection,
- Frequency Domains,
- Jitter Analysis,
- Path Analysis,
- Path Optimizations,
- Practical Engineering,
- S-Parameters,
- Electromagnetic Compatibility,
- Electromagnetism,
- Frequency Domain Analysis,
- Regression Analysis,
- Scattering Parameters,
- Jitter,
- Histograms,
- Noise,
- Mathematical Model,
- Signal Analysis,
- Bit Error Rate,
- Receivers,
- Design Engineering,
- Interference (Signal),
- Device Qualification,
- Stressed Jitter Analysis,
- Physical Link Characterization,
- Link-Path Analysis,
- Frequency-Domain S-Parameter,
- Stressed Link Path Analysis,
- Engineering Design,
- Link Path Optimization
International Standard Book Number (ISBN)
978-1424463053; 978-1424463084
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2010 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
7-1-2010
Publication Date
01 Jul 2010
Disciplines
Citation Information
Nitin Radhakrishnan, Brice Achkir, Jun Fan and James L. Drewniak. "Stressed Jitter Analysis for Physical Link Characterization" Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2010, Fort Lauderdale, FL) (2010) p. 568 - 572 ISSN: 2158-1118; 2158-110X Available at: http://works.bepress.com/james-drewniak/412/