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Article
Cavity Model Method Based with Gradient Current Distribution along the Via for Power Integrity Simulation
Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (2017, Washington, D.C.)
  • Hanzhi Ma
  • Hanbiao Jin
  • Sichen Yang
  • Erping Li
  • Biyao Zhao
  • Chenxi Huang
  • Siqi Bai
  • Albert E. Ruehli, Missouri University of Science and Technology
  • James L. Drewniak, Missouri University of Science and Technology
Abstract

Cavity model is one of the key computational models for power distribution network simulation. However, the conventional cavity model assumes uniform current distribution along the via and its accuracy is limited to the coupling of close-placed vias. This paper presents an improved cavity model based with gradient current distribution assumption. The loop inductance and surface current distribution are simulated by the proposed cavity model. The comparison between improved and original models is employed to demonstrate the advantage of proposed model.

Meeting Name
IEEE International Symposium on Electromagnetic Compatibilty, Signal and Power Integrity (2017: Aug. 7-11, Washington, DC)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
  • Electric Network Analysis,
  • Electromagnetic Compatibility,
  • Cavity Model,
  • Current Density Distribution,
  • Improved Cavity Models,
  • Power Distribution Network,
  • Power Distribution Network Simulations,
  • Power Integrity,
  • Surface Current Distributions,
  • Uniform Current Distribution,
  • Electric Current Distribution Measurement
International Standard Book Number (ISBN)
978-1538622315; 978-1538622292
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
8-1-2017
Publication Date
01 Aug 2017
Citation Information
Hanzhi Ma, Hanbiao Jin, Sichen Yang, Erping Li, et al.. "Cavity Model Method Based with Gradient Current Distribution along the Via for Power Integrity Simulation" Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (2017, Washington, D.C.) (2017) p. 209 - 212 ISSN: 2158-1118
Available at: http://works.bepress.com/james-drewniak/316/