Article
An EMI Estimation for Shielding Edge Treaments on a Printed Circuit Board
Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2016, Ottawa, Canada)
Abstract
Various PCB edge treatments including via stitching and edge plating connecting ground planes can be employed to suppress the EMI from multilayer printed circuit boards. The shielding performance of these edge treatments is studied in this work. Design curves and an empirical equation are given based on parametric study to summarize the variation of the total radiated power (TRP) as a function of slot length (spacing between vias) and number of openings. Comparisons between measurements and simulation suitably agree within engineering accuracy.
Meeting Name
IEEE International Symposium on Electromagnetic Compatibility (2016: Jul. 25-29, Ottawa, Canada)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Sponsor(s)
National Science Foundation (U.S.)
Comments
This material is based upon work supported by the National Science Foundation under Grant No. 0855878.
Keywords and Phrases
- Electromagnetic Compatibility,
- Electromagnetic Shielding,
- Reconfigurable Hardware,
- Shielding,
- Empirical Equations,
- Multilayer Printed Circuit Board,
- Parametric Study,
- Shielding Effectiveness,
- Shielding Performance,
- Total Radiated Power,
- Printed Circuit Boards,
- Apertures,
- Edge Platting,
- EMI,
- TRP
International Standard Book Number (ISBN)
978-1509014415; 978-1509014422
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
7-1-2016
Publication Date
01 Jul 2016
Disciplines
Citation Information
Siqi Bai, Qian Liu, Kartheek Nalla, Jing Li, et al.. "An EMI Estimation for Shielding Edge Treaments on a Printed Circuit Board" Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2016, Ottawa, Canada) (2016) p. 633 - 638 ISSN: 2158-1118 Available at: http://works.bepress.com/james-drewniak/29/