Article
Modeling Shared-Via Decoupling in a Multi-Layer Structure Using the CEMPIE Approach
Proceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (2001, Cambridge, MA)
Abstract
The CEMPIE approach, a circuit extraction technique based on a mixed-potential integral equation, has been applied to model multi-layer structures including power and signal layers. Power-bus noise mitigation effects due to a decoupling capacitor were studied for several cases with different spacing between the capacitor and an integrated circuit (IC). Modeling results indicate that the capacitor sharing a common via with the IC power/ground pins is superior; viz., it results in the lowest power-bus noise under similar conditions.
Meeting Name
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (2001: Oct. 22-31, Cambridge, MA)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
- Circuit Simulation,
- Equivalent Circuits,
- High-Speed Integrated Circuits,
- Integrated Circuit Modelling,
- Integrated Circuit Noise,
- Power Supply Circuits,
- Integral Equations,
- Integrated Circuit Layout,
- Interconnection Networks,
- Mathematical Models,
- Surface Mount Technology,
- Circuit Extraction Technique,
- Partial Element Equivalent Circuits,
- Electric Network Analysis
International Standard Book Number (ISBN)
780370244
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2001 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
10-1-2001
Publication Date
01 Oct 2001
Disciplines
Citation Information
Wei Cui, Jun Fan, Shaofeng Luan and James L. Drewniak. "Modeling Shared-Via Decoupling in a Multi-Layer Structure Using the CEMPIE Approach" Proceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (2001, Cambridge, MA) (2001) p. 265 - 268 Available at: http://works.bepress.com/james-drewniak/262/