Article
High-Speed Serial Link Challenges using Multi-Level Signaling
Proceedings of the 24th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (2015, San Jose, CA)
Abstract
The paper discusses challenges of high-speed serial links using multi-level signaling and gives comparison of the performance of the various channels with different lossy materials and equalization options. Advantages and problems of multi-level signaling are shown based on the test results.
Meeting Name
24th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (2015: Oct. 25-28, San Jose, CA)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
- Jitter,
- equalization,
- High speed serial links,
- Lossy materials,
- Multi-level signaling,
- PAM4,
- Various Channels,
- Electronics packaging,
- NRZ
International Standard Book Number (ISBN)
978-1479936410
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2015 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
12-1-2015
Publication Date
01 Dec 2015
Disciplines
Citation Information
Nana Dikhaminjia, Junping He, E. Hernandez, Mikheil Tsiklauri, et al.. "High-Speed Serial Link Challenges using Multi-Level Signaling" Proceedings of the 24th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (2015, San Jose, CA) (2015) p. 57 - 60 Available at: http://works.bepress.com/james-drewniak/168/