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Article
Effect of Molecular Film Thickness on Thermal Conduction Across Solid-Film Interfaces
Physical Review E - Statistical, Nonlinear, and Soft Matter Physics
  • Zhi Liang, Missouri University of Science and Technology
  • Hai-Lung Tsai, Missouri University of Science and Technology
Abstract

The Brownian Motion and Aggregation of Particles in Nanofluids Often Lead to the Formation of Solid-Film-Solid Structures. the Molecular Thin Film Confined between Nanoparticles May Have Non-Negligible Effects on Thermal Conduction among Nanoparticles. using Nonequilibrium Molecular Dynamics Simulations, We Study Thermal Conduction Across the Ag Particle-Ar Thin-Film Interface. If the Film Contains Only One Molecular Layer, We Find that the Solid-Film Interfacial Thermal Resistance RSF is About 1 Order of Magnitude Smaller Than the Solid-Liquid (Bulk) Interfacial Thermal Resistance RSL. If There Are Two or More Molecular Layers in the Film, It is Shown that RSF Increases Rapidly toward RSL as Film Thickness Increases. by Comparing the Vibrational Density of States of Ag Atoms and Ar Molecules in the Film, We Demonstrate that the Low Thermal Resistance in the Monolayer Film Case is Caused by the Resonant Thermal Transport between Ag Particles and Ar Thin Films. © 2011 American Physical Society.

Department(s)
Mechanical and Aerospace Engineering
Document Type
Article - Journal
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2023 American Physical Society, All rights reserved.
Publication Date
6-10-2011
Publication Date
10 Jun 2011
Citation Information
Zhi Liang and Hai-Lung Tsai. "Effect of Molecular Film Thickness on Thermal Conduction Across Solid-Film Interfaces" Physical Review E - Statistical, Nonlinear, and Soft Matter Physics Vol. 83 Iss. 6 (2011) ISSN: 1550-2376; 1539-3755
Available at: http://works.bepress.com/hai-lung-tsai/48/