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Depth and Breakthrough Detection for Laser Machining
U.S. Patents
  • J. P. Quitter
  • C. E. Yaworsky
  • Hai-Lung Tsai, Missouri University of Science and Technology
Abstract

A system comprises a working laser beam, a sensing laser beam, first and second optical elements, an optical sensor, an aperture and a controller. The first optical element generates a coaxial beam from the working laser beam and the sensing laser beam. The second optical element focuses the coaxial beam onto a workpiece, such that the working laser beam machines the workpiece and the sensing laser beam reflects from the workpiece. The optical sensor senses an intensity of the reflected sensing beam. The aperture determines a focus position by translating along the reflected sensing beam, such that the reflected intensity is maximized. The controller determining a machining parameter of the working laser beam, based on the focus position.

Department(s)
Mechanical and Aerospace Engineering
Patent Application Number
US12/694,435
Patent Number
US8525073B2
Document Type
Patent
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2013 United Technologies Corporation, All rights reserved.
Publication Date
1-1-2010
Publication Date
01 Jan 2010
Citation Information
J. P. Quitter, C. E. Yaworsky and Hai-Lung Tsai. "Depth and Breakthrough Detection for Laser Machining" U.S. Patents (2010)
Available at: http://works.bepress.com/hai-lung-tsai/33/